Method of fabricating MOS transistor having shallow source/drain junction regions

ABSTRACT

A method of fabricating a MOS transistor having shallow source/drain junction regions is provided. A diffusion source layer is formed on a semiconductor substrate on which gate patterns are formed. Same type or different type of impurities are implanted into the diffusion source layer several times in different directions. As a result, dislocation does not occur and the impurity concentration of the diffusion source layer can be nonuniformly controlled so that damage to the crystal structure of the semiconductor substrate does not occur. Also, the impurities nonuniformly contained in the diffusion source layer are diffused into the semiconductor substrate by a solid phase diffusion method to form shallow source/drain junction regions having LDD regions and highly doped source/drain regions by a self-alignment method.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of fabricating a MOStransistor, and more particularly, to a method of a MOS transistorhaving shallow source/drain junction regions.

2. Description of the Related Art

In general, gate patterns composed of gate oxide layers and gateelectrodes are formed on a semiconductor substrate. Source/drainjunction regions are formed in the semiconductor substrate underneathboth sidewalls of the gate patterns. As a result, MOS transistors areformed.

The source/drain junction regions must be shallow junction regions asthe MOS transistors are highly integrated. The shallow junction regionsmust be junction regions, which are formed to a shallow depth into asubstrate, have a high concentration and high activation rate ofimpurities to reduce resistance, and has an abrupt junction profile inhorizontal and vertical directions.

Conventional source/drain junction regions are formed by an ionimplantation method or a solid phase diffusion method. In the ionimplantation method, an ion implanter highly accelerates impurities witha high acceleration voltage and then implants the impurities into asubstrate to form source/drain junction regions. In the solid phasediffusion method, a solid phase diffused source is formed on asubstrate, and then a dopant in the solid phase diffusion source isdiffused and doped into the substrate to form shallow junction regions.

In order to avoid the confusion of the terminology used in this detaileddescription of the present invention, impurities implanted by the ionimplantation method are described as “impurities”, and impuritiesimplanted by the solid phase diffusion method are described as “dopant”.Also, implanting ionic impurities is referred to as “ion implantation”,and diffusing impurities of a substrate already containing impurities bythe solid phase diffusion method is referred to as “doping”.

The ion implantation method damages the crystal structure of thesubstrate because of the kinetic energy of impurity ions, and thusdislocation occurs. The dislocation causes a sharp diffusion of theimplanted impurities as well as leakage in source/drain junctionregions. Thus, it becomes impossible to form shallow source/drainjunction regions. The solid phase diffusion method has difficultyincreasing the doping concentration of dopant in the solid phasediffusion source sufficient for shallow source/drain junction regionshaving a low resistance. Also, there is a problem of preciselycontrolling the doping concentration of the dopant in the solid phasediffusion source.

SUMMARY OF THE INVENTION

To solve the above-described problems, it is an object of the presentinvention to provide a method of fabricating a MOS transistor havingshallow source/drain junction regions in which dislocation does notoccur and the doping concentration of impurities is preciselycontrolled.

Accordingly, to achieve the above object, according to an embodiment ofthe present invention, there is provided a method of fabricating a MOStransistor. In the method, gate patterns are formed on a semiconductorsubstrate and a diffusion source layer is on the entire surface of thesemiconductor substrate. The diffusion source layer may be an USG layeror a silicon oxide layer. The USG layer may be formed by spin-coatingand densifying a liquid silicate glass. The silicon oxide layer may beformed by CVD or PECVD using a compound gas containing SiH₄ and O₂, dryoxidation, or wet oxidation. The whole of the diffusion source layer ora portion of the diffusion source layer may be etched to be thin.

The same type or different type of impurities are implanted into thediffusion source layer several times in different directions so that theimpurity concentration of portions of the diffusion source layer onupper surfaces of the gate patterns and the semiconductor substrate ishigher than the impurity concentration of portions of the diffusionsource layer on sidewalls of the gate patterns due to a shadow effect.The implantation of the impurities into the diffusion source layer maybe performed using a general ion implanter or a plasma ion implanterincluding a Pill and an ISI. The impurities may be implanted into thediffusion source layer at an angle from the semiconductor substrate toadjust the impurity concentration of the portions of the diffusionsource layer on the sidewalls of the gate patterns to 10¹⁷-10²² cm⁻³.The impurities may be implanted vertically into the diffusion sourcelayer to adjust the impurity concentration of the portions of thediffusion source layer on the upper surfaces of the gate patterns andthe semiconductor substrate to 10¹⁸-10²² cm⁻³.

Impurities contained in the diffusion source layer are diffused into thesemiconductor substrate by a solid phase diffusion method to formshallow source/drain junction regions having LDD regions underneath thesidewalls of the gate patterns and highly doped source/drain regions bya self-alignment method. Forming the shallow source/drain junctionregions by the solid phase diffusion method may be performed using RTA,spike annealing, or laser annealing. It is preferable that in the RTA,the semiconductor substrate on which the diffusion source layercontaining the impurities is formed is annealed at a temperature of950-1150° C. for 1-1000 seconds in an inert gas atmosphere. It ispreferable that in the spike annealing, the semiconductor substrate onwhich the diffusion source layer containing the impurities is formed isannealed at a temperature of 950-1200° C. in an inert gas atmosphere.Preferably, the shallow source/drain junction regions have a dopingdepth of 50 nm or less on the semiconductor substrate and a dopingconcentration 10¹⁸-10²² cm⁻³.

According to another embodiment of the present invention, there isprovided a method of fabricating a MOS transistor. In the method, gatepatterns are formed on a semiconductor substrate in which a P-well andan N-well are formed. A diffusion source layer is formed on the entiresurface of the semiconductor substrate. A photoresist pattern is formedon the diffusion source layer to open the N-well or the P-well. The sametype or different type of impurities are implanted first into a portionof the diffusion source layer over the N-well and then into a portion ofthe diffusion source layer over the P-well, or first into the portion ofthe diffusion source layer over the P-well and then into the portion ofthe diffusion source layer over the N-well, several times in differentdirections so that the impurity concentration of portions of thediffusion source layer on upper surfaces of the gate patterns and thesemiconductor substrate is higher than the impurity concentration ofportions of the diffusion source layer at sidewalls of the gate patternsdue to a shadow effect. The photoresist pattern is removed. Impuritiescontained in the portions of the diffusion source layer over the N-welland the P-well are diffused into the semiconductor substrate by a solidphase diffusion method to form shallow source/drain junction regionshaving LDD regions underneath the sidewalls of the gate patterns andhighly doped source/drain regions by a self-alignment method.

As described above, according to the present invention, the same type ordifferent type of impurities are implanted into the diffusion sourcelayer several times in different directions. As a result, dislocationdoes not occur and the impurity concentration of the diffusion sourcelayer can be nonuniformly controlled. Also, the impurities nonuniformlycontained in the diffusion source layer are diffused into thesemiconductor substrate by a solid phase diffusion method to formshallow source/drain junction regions having LDD/SDE regions and highlydoped source/drain regions by a self-alignment method.

BRIEF DESCRIPTION OF THE DRAWINGS

The above object and advantages of the present invention will becomemore apparent by describing in detail preferred embodiments thereof withreference to the attached drawings in which:

FIGS. 1 through 6 are cross-sections explaining a method of fabricatinga MOS transistor having shallow source/drain junction regions accordingto a first embodiment of the present invention; and

FIGS. 7 through 17 are cross-sections explaining a method of fabricatinga MOS transistor having shallow source/drain junction regions accordingto a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the attached drawings. However, the embodimentsof the present invention may be modified into various other forms, andthe scope of the present invention must not be interpreted as beingrestricted to the embodiments. Rather, the embodiments are provided tomore completely explain the present invention to those skilled in theart. In drawings, the thicknesses of layers or regions are exaggeratedfor clarity. Like reference numerals in the drawings denote the samemembers. Also, when it is written that a layer is formed “on” anotherlayer or a substrate, the layer may be formed directly on the otherlayer or the substrate, or other layers may intervene therebetween.

FIGS. 1 through 6 are cross-sections explaining a method of fabricatinga MOS transistor having shallow source/drain junction regions accordingto a first embodiment of the present invention. Referring to FIG. 1,field oxide layers 12 are formed on a semiconductor substrate 10, e.g.,a p-type or n-type silicon substrate to define active regions andinactive regions. Gate patterns 18 composed of gate oxide layers 14 andgate electrodes 16 are formed on the semiconductor substrate 10 in theactive regions. To form the gate patterns 18, the surface of thesemiconductor substrate 10 is oxidized to form a silicon oxide layer, apolysilicon layer having a thickness of 100-300 nm is deposited on thesilicon oxide layer by low pressure chemical vapor deposition (LPCVD),and the polysilicon layer and the silicon oxide layer are patterned byphotolithography.

Referring to FIG. 2, a diffusion source layer 20 is formed on the entiresurface of the semiconductor substrate 10. The diffusion source layer 20is formed to a thickness of 20-400 nm. The diffusion source layer 20serves as a buffer layer for preventing the semiconductor substrate 10from being damaged during the implantation of impurity ions.

The diffusion source layer 20 is an undoped silicate glass (USG) layeror a silicon oxide layer. To form the USG layer, a liquid silicate glassis spin-coated and then densified at a temperature of 200-600° C. for2-30 minutes. The silicon oxide layer is formed by CVD or plasmaenhanced chemical vapor deposition (PECVD) using a compound gascontaining SiH₄, and O₂, or dry oxidation or wet oxidation. The whole ofthe diffusion source layer 20 or a portion of the diffusion source layer20 may be etched to be thin.

Referring to FIGS. 3 and 4, impurities 22 and 26 are implanted into thediffusion source layer 20 at an angle. In other words, as shown withreference numeral 24 in FIG. 3, the impurities 22 are radiated at anangle from the left side of the semiconductor substrate 10 to beimplanted into portions of the diffusion source layer 20 on the leftsidewalls and upper surfaces of the gate patterns 18, the surfaces ofthe field oxide layers 12, and the surface of the semiconductorsubstrate 10. In FIG. 4, the impurities 26 are radiated at an angle fromthe right side of the semiconductor substrate 10 to be implanted intoportions of the diffusion source layer 20 on the right sidewalls andupper surfaces of the gate patterns 18, the surfaces of the field oxidelayers 12, and the surface of the semiconductor substrate 10.

As a result, a diffusion source layer 28, into which impurities areuniformly implanted, is formed. In particular, the impurityconcentration of portions of the diffusion source layer 28 formed byimplanting impurities into both sidewalls of the gate patterns 18 isadjusted to 10¹⁷-10²² cm⁻³.

The impurities 22 and 26, which are implanted into the diffusion sourcelayer 20, have a conductivity type opposite to the conductivity type ofthe semiconductor substrate 10. For example, if the semiconductorsubstrate 10 is a p-type silicon substrate, the impurities 22 and 26 aren-type impurities, e.g., P, As, or Sb. If the semiconductor substrate 10is an n-type silicon substrate, the impurities 22 and 26 are p-typeimpurities, e.g., B or In.

Instead of P or B, a heavy impurity element such as As (or Sb) or In isselected as the impurities 22 and 26 in consideration of a subsequentprocess for forming lightly doped drain (LDD) regions or source/drainextension regions (SDE). Thus, the diffusion depth may be reduced in asubsequent heat treatment process.

The impurities 22 and 26 are implanted into the diffusion source layer20 at an angle using a general ion implanter or a plasma ion implanterincluding a Plasma Immersion Ion Implanter (PIII) and an Ion ShowerImplanter (ISI).

The plasma ion implanter uses low acceleration voltages in whichimpurity ions are implanted in a predetermined direction. The Pilloperates by generating plasma over a wafer, i.e., a semiconductorsubstrate, periodically applying negative voltages to the wafer, andaccelerating plasma ions to bombard the wafer with the plasma ions. TheISI operates by extracting/accelerating plasma ions away from the waferto a large area electrode to bombard the wafer with the plasma ions.

When the impurities 22 and 26 are implanted into the diffusion sourcelayer 20 at an angle, an acceleration voltage of the impurities 22 and26 is controlled so that the position of maximum impurity concentrationis within the diffusion source layer 20. As a result, damage to thecrystal structure of the semiconductor substrate is reduced.

In particular, in the plasma ion implanter, the impurity ions 22 and 26radiated at low acceleration voltages may be implanted into thediffusion source layer 20 to a high concentration of over 10¹³-10¹⁵ cm⁻³without damaging to the crystal structure of the semiconductor substrate10.

Referring to FIG. 5, impurities 29 are additionally implanted into thediffusion source layer 28, into which the impurities 22 and 26 arealready implanted, in a vertical direction, i.e., perpendicular to thesemiconductor substrate 10. Here, the impurities 29 are selectivelyimplanted into portions of the diffusion source layer 28 exposed to thevertically moving impurities 29, i.e., lateral portions of the diffusionsource layer 28 formed on the upper surfaces of the gate patterns 18,the surface of the semiconductor substrate 10, and the surfaces of thefield oxide layers 12, to a high concentration of over 10²¹ cm⁻³. Theimpurities 29 are not additionally implanted into portions of thediffusion source layer 28 not exposed to the vertically moving impurityions 29, i.e., vertical portions of the diffusion source layer 28 formedat both sidewalls of the gate patterns 28, due to a shadow effect. Also,the impurities 29 may be well-diffused compared to the impurities 22 and26 shown in FIGS. 3 and 4.

When the impurities 29 are implanted vertically into the diffusionsource layer 28, the impurity concentration of portions of the diffusionsource layer 28 formed on the upper surfaces of the gate patterns 18 andthe surface of the semiconductor substrate 10 is adjusted to 10¹⁸-10²³cm⁻³. This is to maintain the doping depth of shallow junction regionsthat will be formed later to a depth of 50 nm or less and the dopingconcentration of the shallow junction regions within a range of10¹⁸-10²² cm⁻³.

When the impurities 29 are implanted vertically into the diffusionsource layer 28, if the semiconductor substrate 10 is an n-type siliconsubstrate, the impurities 29 are B or In and if the semiconductorsubstrate 10 is a p-type silicon substrate, the impurities 29 are P, As,or Sb.

In particular, instead of As (or Sb) or In, a light impurity elementsuch as P or B is selected as the impurities 29 in consideration of asubsequent process for forming highly doped source/drain regions. As aresult, the diffusion depth may be deepened in a subsequent heattreatment process. Thus, the impurities 22and 26, and 29 implanted at anangle and vertically into the diffusion source layer 28 may be the sametype or different type of impurities even though they are implanted intothe same type semiconductor substrate.

If the impurities 29 are implanted vertically into the diffusion sourcelayer 28, the impurity concentration of portions 30 of the diffusionsource layer 28 on the upper surfaces of the gate patterns 18, thesurface of the semiconductor substrate 10, and the surfaces of the fieldoxide layers 12 is higher than the impurity concentration of theportions 34 of the diffusion source layer 28 at the sidewalls of thegate patterns 18. Portions 32 of the diffusion source layer 28 formed onthe slanted sides of the field oxide layers 12 have a mediumconcentration level of impurities.

Accordingly, in FIGS. 3 through 5, the same type or different type ofimpurities are implanted into the diffusion source layer 20 severaltimes in different directions. Thus, the impurity concentration of theportions 30 of the diffusion source layer 28 on the upper surfaces ofthe gate patterns 18 and the surface of the semiconductor substrate 10may be higher than the impurity concentration of the portions 34 of thediffusion source layer 28 at the sidewalls of the gate patterns 18 dueto the shadow effect. In other words, the portions 30 of the diffusionsource layer 28 on the semiconductor substrate 10 are a highconcentration diffusion source, and the portions 34 of the diffusionsource layer 28 at the sidewalls of the gate patterns 18 are a lowconcentration diffusion source.

Moreover, the same type or different type of impurities are implantedinto the diffusion source layer 20 several times in differentdirections. As a result, the impurity concentration of the diffusionsource layer 20 is controlled to be nonuniform. Thus, the dopingconcentration of shallow source/drain regions composed of LDD regionsand highly doped source/drain regions that will be formed later can beprecisely controlled so that damage to the crystal structure of thesemiconductor substrate 10 does not occur.

Referring to FIG. 6, the semiconductor substrate 10 on which the highconcentration diffusion source and the low concentration diffusionsource are formed is rapidly heat-treated to diffuse the impurities inthe portions 30, 32, and 34 of the diffusion source layer 28 into thesemiconductor substrate 10. As a result, shallow source/drain junctionregions 36 and 38 are formed.

In other words, the impurities in the portions 30, 32, and 34 of thediffusion source layer 28 is rapidly heat-treated and diffused by asolid phase diffusion method to form the shallow source/drain junctionregions 36 and 38. Thus, the shallow source/drain junction regions 36and 38 are easily formed and the activation efficiency of the impuritiesis increased if the solid phase diffusion method is used.

The rapid heat-treatment represents a rapid thermal annealing (RTA), aspike annealing, or a laser annealing which is suitable for formingshallow junctions in solid phase diffusion.

In the RTA, the semiconductor substrate 10 on which the portions 30, 32,and 34 of the diffusion source layer 28 containing the impurities areformed is annealed at a temperature of 950-1150° C. for 1-1000 secondsin an inert gas atmosphere. Thus, shallow source/drain junction regions36 and 38 having a doping depth of 50 nm or less on the semiconductorsubstrate 10, preferably 8-35 nm, and a doping concentration of10¹⁸-10²² cm⁻³ may be formed.

In the spike annealing, the semiconductor substrate 10 on which theportions 30, 32, and 34 of the diffusion source layer 28 containing theimpurities are formed is annealed at a temperature of 950-1200° C. in aninert gas atmosphere. Thus, the shallow source/drain junction regions 36and 38 having a doping depth of 50 nm or less on the semiconductorsubstrate 10, preferably 8-35 nm, and a doping concentration of10¹⁸-10²² cm⁻³ may be formed.

When the shallow source/drain junction regions 36 and 38 are formed bythe rapid heat-treatment, there is a difference between the dopingconcentration of the shallow junction region 38 diffused from the highconcentration diffusion source on the semiconductor substrate 10 and thedoping concentration of the shallow junction region 36 diffused from thelow concentration diffusion source at the sidewalls of the gate patterns18. As a result, highly doped source/drain regions (38) are formed nearthe surface of the semiconductor substrate 10, and LDD regions (36) areformed near the surface of the semiconductor substrate 10 underneath thesidewalls of the gate patterns 18.

In other words, in this embodiment, the LDD regions (36) and thesource/drain extension regions (36) are self-aligned near the surface ofthe semiconductor substrate 10 underneath the sidewalls of the gatepatterns 18. The highly doped source/drain regions (38) are formedadjacent to the LDD regions (36). The process of forming the LDD regions(36) and the highly doped source/drain regions (38) by a self-alignmentmethod is simpler than a process of forming LDD regions and highly dopedsource/drain regions by two-time ion implantation using conventionalsidewall spacers and is beneficially utilized as a process of formingnano devices suitable for forming shallow junctions.

FIGS. 7 through 17 are cross-sections explaining a method of fabricatinga MOS transistor having shallow source/drain junction regions accordingto a second embodiment of the present invention. In detail, the secondembodiment of the present invention is the same as the first embodimentexcept that a method of fabricating a CMOS transistor is described.

Referring to FIG. 7, field oxide layers 56 are formed on a semiconductorsubstrate 50, e.g., a p-type or n-type silicon substrate, to define anactive region and an inactive region. A P-well 52 and an N-well 54 areformed on the semiconductor substrate 50 in the active region and theinactive region.

Gate patterns 62 composed of gate oxide layers 58 and gate electrodes 60are formed on the semiconductor substrate 50 in the active region. Thegate patterns 62 are formed to the same thickness and by the same methodas the gate patterns 18 of FIG. 1 in the first embodiment.

Referring to FIG. 8, a diffusion source layer 64 is formed on the entiresurface of the semiconductor substrate 50. The diffusion source layer 64is formed to a thickness of 20-400 nm. The diffusion source layer 64serves as a buffer layer for preventing the semiconductor substrate 50from being damaged during the implantation of impurity ions. Thediffusion source layer 64 is formed by the same method as the diffusionsource layer 20 of the first embodiment. The whole of the diffusionsource layer 64 or a portion of the diffusion source layer 64 may beetched to be thin.

Referring to FIG. 9, a first photoresist pattern 66 is formed on aportion of the diffusion source layer 64 over the P-well 52 to open aportion of the diffusion source layer 64 over the N-well 54. In thisembodiment, the portion of the diffusion source layer 64 over the N-well54 is first opened. However, the portion of the diffusion source layer64 over the P-well 52 may be first opened.

Referring to FIGS. 10 and 11, impurities 68 and 72 are implanted intothe portion of the diffusion source layer 64 over the N-well 54, whichare opened, at an angle. In other words, as shown with reference numeral70 in FIG. 10, the impurities 68 are radiated at an angle from the leftside of the semiconductor substrate 50 to be implanted into portions ofthe diffusion source layer 64 on the left sidewall and upper surface ofthe gate pattern 62, the surfaces of the field oxide layers 56, and thesurface of the semiconductor substrate 50 over the N-well 54. In FIG.11, the impurities 72 are radiated at an angle from the right side ofthe semiconductor substrate 50 to be implanted into portions of thediffusion source layer 64 on the right sidewall and upper surface of thegate pattern 62, the surfaces of the field oxide layers 56, and thesurface of the semiconductor substrate 50 over the N-well 54.

As a result, a diffusion source layer 74, into which impurities areuniformly implanted, is formed. In particular, the impurityconcentration of portions of the diffusion source layer 74 on bothsidewalls of the gate pattern 62 is adjusted to 10¹⁷-10²² cm⁻³. Theimpurities 68 and 72 contained in the diffusion source layer 74 arep-type impurities, e.g., B or In.

Instead of B, a heavy impurity element such as In is selected as theimpurities 68 and 72 contained in the diffusion source layer 74 inconsideration of a subsequent process for forming LDD regions orsource/drain extension regions. Thus, the diffusion depth may be reducedin a subsequent heat treatment process. The process of implanting theimpurities 68 and 72 into the diffusion source layer 74 is the same asthat of the first embodiment described with reference to FIGS. 3 and 4.Thus, its detailed description will be omitted.

Referring to FIG. 12, the process of implanting impurities into thediffusion source layer 74 in a vertical direction, i.e., perpendicularto the semiconductor substrate 50 is the same as that of the firstembodiment described with reference to FIG. 5. In detail, impurities 76are implanted vertically into the portion of the diffusion source layer74 over the N-well 54. In other words, p-type impurities, e.g., B or In,are implanted into the portion of the diffusion source layer 74 over theN-well 54. Here, the impurities 76 are selectively implanted into theportions of the diffusion source layer 74 over the N-well 54 exposed tothe vertically moving impurities 76, i.e., lateral portions of thediffusion source layer 74 on the upper surface of the gate pattern 62,the surface of the semiconductor substrate 50, the surfaces of the fieldoxide layers 56, to a high concentration of over 10²¹ cm⁻³. Theimpurities 76 are not additionally implanted into portions of thediffusion source layer 74 over the N-well 54 not exposed to thevertically moving impurities 76, i.e., vertical portions of thediffusion source layer 74 at both sidewalls of the gate pattern 62 overthe N-well, due to a shadow effect.

When the impurities 76 are implanted vertically into the portion of thediffusion source layer 74 over the N-well 54, instead of In, a lightimpurity element such as B is selected as the impurities 76 inconsideration of a subsequent process for forming highly dopedsource/drain regions. Thus, the diffusion depth may be deepened in asubsequent heat treatment process. As a result, the same type ordifferent type of impurities may be implanted at an angle and verticallyinto the portion of the diffusion source layer 74 over the N-well 54.

When the impurities 76 are implanted vertically into the diffusionsource layer 74 over the N-well 54, the impurity concentration of theportions of the diffusion source layer 74 on the upper surface of thegate pattern 62 and the surface of the semiconductor substrate 50 isadjusted to 10¹⁸-10²³ cm⁻³. This is to maintain the doping depth ofshallow source/drain junction regions that will be formed later to adepth of 50 nm or less and the doping concentration of the shallowsource/drain junction regions within a range of 10¹⁸-10²² cm⁻³.

If the impurities 76 are implanted vertically into the portion of thediffusion source layer 74 over the N-well 54, the impurity concentrationof portions 78 of the diffusion source layer 74 on the upper surface ofthe gate pattern 62, the surface of the semiconductor substrate 50, andthe surfaces of the field oxide layers 56 is higher than the impurityconcentration of portions 82 of the diffusion source layer 74 at bothsidewalls of the gate pattern 62. The impurity concentration of portions80 of the diffusion source layer 74 on the slanted sides of the fieldoxide layers 56 has a medium concentration level of impurities. Also,the impurities 76 may be well-diffused compared to the impurities 68 and72 described with reference to FIGS. 10 and 11.

Accordingly, in FIGS. 10 through 12, the same type or different type ofimpurities are implanted into the portion of the diffusion source layer64 over the N-well 54 several times in different directions. Thus, theimpurity concentration of the portions 78 of the diffusion source layer74 on the upper surface of the gate pattern 62 and the surface of thesemiconductor substrate 50 may be higher than the impurity concentrationof the portions 82 of the diffusion source layer 74 at both sidewalls ofthe gate pattern 62 due to the shadow effect. In other words, theportions 78 of the diffusion source layer 74 on the semiconductorsubstrate 50 are a high concentration diffusion source, and the portions82 of the diffusion source layer 74 at both sidewalls of the gatepattern 62 are a low concentration diffusion source.

Moreover, the impurity concentration of the diffusion source layer 64 iscontrolled to be nonuniform. Thus, the doping concentration of shallowsource/drain regions composed of LDD regions and highly dopedsource/drain regions that will be formed later can be preciselycontrolled so that damage to the crystal structure of the semiconductorsubstrate 50 does not occur.

Referring to FIG. 13, the first photoresist pattern 66 over the P-well52 is removed. Next, a second photoresist pattern 84 is formed on theportion of the diffusion source layer 64 over the N-well 54 to open theportion of the diffusion source layer 64 over the P-well 52.

Referring to FIGS. 14 and 15, an ion implantation process described withreference to FIGS. 14 and 15 is the same as the ion implantation processdescribed with reference to FIGS. 10 and 11. In other words, impurities86 and 90 are implanted into the portion of the diffusion source layer64 over the P-well 52, which is opened, at an angle. Here, n-typeimpurities, e.g., P, As, or SB, are implanted into the portion of thediffusion source layer 64 over the P-well 52 which is opened. Inparticular, instead of P, a heavy impurity element such as As or Sb isselected as the impurities 86 and 90 contained in the diffusion sourcelayer 64 in consideration of a process for forming LDD regions andsource/drain extension regions. Thus, the diffusion depth may be reducedin a subsequent heat treatment process.

In detail, as shown with reference numeral 88 in FIG. 14, the impurities86 are radiated at an angle from the left side of the semiconductorsubstrate 50 to be implanted into portions of the diffusion source layer64 on the left sidewall and upper surface of the gate pattern 62, thesurfaces of the field oxide layers 56, and the surface of thesemiconductor substrate 10. In FIG. 15, the impurities 90 are radiatedat an angle from the right side of the semiconductor substrate 50 to beimplanted into portions of the diffusion source layer 64 on the rightsidewall and upper surface of the gate pattern 62, the surfaces of thefield oxide layers 56, and the surface of the semiconductor substrate50.

As a result, a diffusion source layer 92, into which impurities areuniformly implanted, is formed. In particular, the impurityconcentration of portions of the diffusion source layer 92 at bothsidewalls of the gate pattern 62 is adjusted to 10¹⁷-10²² cm⁻³.

Referring to FIG. 16, an ion implantation process described withreference to FIG. 16 is the same as the ion implantation processdescribed with reference to FIG. 12 except that n-type impurities, e.g.,P, As, or Sb, are implanted into the P-well 52.

In detail, impurities 94 are radiated into the diffusion source layer 92over the P-well 52 in a vertical direction, i.e., perpendicular to thesemiconductor substrate 50. Here, the impurities 94 are selectivelyimplanted into portions of the diffusion source layer 92 over the P-well52 exposed to the vertically moving impurities 94, i.e., lateralportions of the diffusion source layer 92 formed on the upper surface ofthe gate pattern 62, the surface of the semiconductor substrate 50, andthe surfaces of the field oxide layers 56, to a high concentration ofover 10²¹ cm⁻³. The impurities 94 are not additionally implanted intoportions of the diffusion source layer 92 over the P-well 52 not exposedto the vertically moving impurity ions 94, i.e., vertical portions ofthe diffusion source layer 92 formed at both sidewalls of the gatepattern 62, due to a shadow effect.

When the impurities 94 are implanted vertically into the diffusionsource layer 92 over the P-well 52, instead of Sb or As, a lightimpurity element such as P is selected as the impurities 94 inconsideration of a subsequent process for forming highly dopedsource/drain regions. Thus, the diffusion depth may be deepened in asubsequent heat treatment process. As a result, the same type ordifferent type of impurities may be implanted at an angle and verticallyinto the diffusion source layer 64 over the P-well 52.

When the impurities 94 are implanted vertically into the diffusionsource layer 92 over the P-well 52, the impurity concentration of theportions of the diffusion source layer 92 on the upper surface of thegate pattern 62 and the surface of the semiconductor substrate 50 isadjusted to 10¹⁸-10²³ cm⁻³. This is to maintain the doping depth ofshallow source/drain junction regions that will be formed later to adepth of 50 nm or less and the doping concentration of the shallowsource/drain junction regions within a range of 10¹⁸-10²² cm⁻³.

If the impurities 94 are implanted vertically into the diffusion sourcelayer 92 over the P-well 52, the impurity concentration of portions 96of the diffusion source layer 92 on the upper surface of the gatepattern 62, the surface of the semiconductor substrate 50, and thesurfaces of the field oxide layers 56 is higher than the impurityconcentration of portions 100 of the diffusion source layer 92 at bothsidewalls of the gat pattern 62. The impurity concentration of portions98 of the diffusion source layer 92 on the slanted sides of the fieldoxide layers 56 has a medium concentration level of impurities. Also,the impurities 94 may be well-diffused compared to the impurities 86 and90 described with reference to FIGS. 14 and 15.

Accordingly, in FIGS. 14 through 16, the same type or different type ofimpurities are implanted into the diffusion source layer 64 over theP-well 52 several times in different directions. Thus, the impurityconcentration of the portions 96 of the diffusion source layer 92 on theupper surface of the gate pattern 62 and the surface of thesemiconductor substrate 50 may be higher than the impurity concentrationof the portions 100 of the diffusion source layer 92 at the sidewalls ofthe gate pattern 62 due to the shadow effect. In other words, theportions 96 of the diffusion source layer 92 on the semiconductorsubstrate 50 are a high concentration diffusion source, and the portions100 of the diffusion source layer 92 at the sidewalls of the gatepattern 62 are a low concentration diffusion source.

Moreover, the same type or different type of impurities are implantedinto the diffusion source layer 64 over the P-well 52 several times indifferent directions. As a result, the impurity concentration of thediffusion source layer 92 is controlled to be nonuniform. Thus, thedoping concentration of shallow source/drain junction regions composedof LDD regions and highly doped source/drain regions that will be formedlater can be precisely controlled so that damage to the crystalstructure of the semiconductor substrate 50 does not occur.

Referring to FIG. 17, the second photoresist pattern 84 over the N-well54 is removed. Next, the semiconductor substrate 50 on which theportions 78, 80, 82, 96, 98, and 100 of the diffusion source layer 64containing the impurities are formed is rapidly heat-treated to diffusethe impurities in the portions 78, 80, 82, 96, 98, and 100 of thediffusion source layer 64 into the semiconductor substrate 50. As aresult, shallow source/drain junction regions 102, 104, 106 and 108 areformed.

In other words, the impurities in the portions 78, 80, and 82 of thediffusion source layer 74 over the N-well 54 is rapidly heat-treated anddiffused by a solid phase diffusion method to form the shallowsource/drain junction regions 102 and 104. The impurities in theportions 96, 98, and 100 of the diffusion source layer 92 over theP-well 52 is rapidly heat-treated and diffused by a solid phasediffusion method to form the shallow source/drain junction regions 106and 108. Thus, the shallow source/drain junction regions 102, 104, 106,and 108 are easily formed and the activation efficiency of theimpurities is increased if the solid phase diffusion method is used.

The rapid heat-treatment represents a RTA, a spike annealing, or a laserannealing which is suitable for forming shallow junctions in solid phasediffusion.

In the RTA, the semiconductor substrate 50 on which the portions 78, 80,82, 96, 98, and 10 of the diffusion source layer 64 containingimpurities are formed is annealed at a temperature of 950-1150° C. for1-1000 seconds in an inert gas atmosphere. Thus, shallow source/drainjunction regions 102, 104, 106, and 108 having a doping depth of 50 nmor less on the semiconductor substrate 50, preferably 8-35 nm, and adoping concentration of 10¹⁸-10²² cm⁻³ may be formed.

In the spike annealing, the semiconductor substrate 50 on which theportions 78, 80, 82, 96, 98, and 10 of the diffusion source layer 64containing impurities are formed is annealed at a temperature of950-1200° C. in an inert gas atmosphere. Thus, the shallow source/drainjunction regions 102, 104, 106, and 108 having a doping depth of 50 nmor less on the semiconductor substrate 50, preferably 8-35 nm, and adoping concentration of 10¹⁸-10²² cm⁻³ may be formed.

When the shallow source/drain junction regions 102, 104, 106, and 108are formed by the rapid heat-treatment, there is a difference betweenthe doping concentration of the shallow junction regions 104 and 108diffused from the portions 78 and 96 of the diffusion source layer 64having a high concentration on the semiconductor substrate 50 and thedoping concentration of the shallow junction regions 102 and 106diffused from the portions 82 and 100 of the diffusion source layer 64having a low concentration at the sidewalls of the gate patterns 62.

As a result, LDD regions (102 and 106) and source/drain extensionregions (102 and 106) are self-aligned near the surface of thesemiconductor substrate 50 underneath both sidewalls of the gatepatterns 62. Highly doped source/drain regions (104 and 108) are formedadjacent to the LDD regions (102 and 106).

The process of forming the LDD regions (102 and 106) and the highlydoped source/drain regions (104 and 108) by a self-alignment method issimpler than a process of forming LDD regions and highly dopedsource/drain regions by two-time ion implantation using conventionalsidewall spacers and is beneficially utilized as a process of formingnano devices suitable for forming shallow junctions.

Moreover, in this embodiment, the portions 78, 80, and 82 of thediffusion source layer 64 over the N-well 54 and the portions 96, 98,and 100 of the diffusion source layer 64 over the P-well 52 are formed,and then are rapidly heat-treated. As a result, the LDD regions (102 and106) and the highly doped source/drain regions (104 and 108) are formedby a self-alignment method.

However, as shown in FIG. 12, the portions 78, 80, and 82 of thediffusion source layer 64 may be formed over the N-well 54, and thenrapidly heat-treated to self-align the LDD region (102) and the highlydoped source/drain region 104. Next, as shown in FIG. 16, the portions96, 98, and 100 of the diffusion source layer 64 may be formed over theP-well 52, and then rapidly heat-treated to self-align the LDD region(106) and the highly doped source/drain region (108).

As described above, according to the present invention, a diffusionsource layer is formed on a semiconductor substrate on which gatepatterns are formed. Next, the same type or different type of impuritiesare implanted into the diffusion source layer several times in differentdirections. As a result, dislocation does not occur and the impurityconcentration of the diffusion source layer can be nonuniformlycontrolled so that damage to the crystal structure of the semiconductorsubstrate does not occur.

Moreover, impurities contained in the diffusion source layer having anonuniform impurity concentration are diffused into the semiconductorsubstrate by a solid phase diffusion method. Thus, shallow source/drainjunction regions composed of LDD regions and highly doped source/drainregions are formed near the surface of the semiconductor substrateunderneath the sidewalls of the gate patterns by a self-alignmentmethod.

What is claimed is:
 1. A method of fabricating a MOS transistorcomprising: forming gate patterns on a semiconductor substrate; forminga diffusion source layer on the entire surface of the semiconductorsubstrate; implanting the same type or different type of impurities intothe diffusion source layer according to a plurality of implantationangles relative to the semiconductor substrate so that the impurityconcentration of portions of the diffusion source layer on uppersurfaces of the gate patterns and the semiconductor substrate is higherthan the impurity concentration of portions of the diffusion sourcelayer on sidewalls of the gate patterns due to a shadow effect; anddiffusing impurities contained in the diffusion source layer into thesemiconductor substrate by a solid phase diffusion method to formshallow source/drain junction regions having LDD regions underneath thesidewalls of the gate patterns and highly doped source/drain regions bya self-alignment method.
 2. The method of claim 1, wherein the diffusionsource layer is an USG layer or a silicon oxide layer.
 3. The method ofclaim 2, wherein the USG layer is formed by spin-coating and densifyinga liquid silicate glass.
 4. The method of claim 3, wherein the liquidsilicate glass is densified at a temperature of 200-600° C. for 2-30minutes.
 5. The method of claim 1, wherein the silicon oxide layer isformed by one of CVD and PECVD using a compound gas containing SiH₄ andO₂, dry oxidation, and wet oxidation.
 6. The method of claim 1, whereinthe diffusion source layer is formed to a thickness of 20-400 nm.
 7. Themethod of claim 1, wherein the whole of the diffusion source layer or aportion of the diffusion source layer isetched to be thin.
 8. The methodof claim 1, wherein the implantation of the impurities into thediffusion source layer is performed using one of a general ion implanterand a plasma ion implanter including a Pill and an ISI.
 9. The method ofclaim 1, wherein the impurities are implanted into the diffusion sourcelayer at an angle from the semiconductor substrate to adjust theimpurity concentration of the portions of the diffusion source layer onthe sidewalls of the gate patterns to 10¹⁷-10²² cm⁻³.
 10. The method ofclaim 1, wherein the impurities are implanted vertically into thediffusion source layer to adjust the impurity concentration of theportions of the diffusion source layer on the upper surfaces of the gatepatterns and the semiconductor substrate to 10¹⁸-10²² cm⁻³.
 11. Themethod of claim 1, wherein the impurities implanted into a portion ofthe diffusion source layer over a P-well are one of P, As, and Sb, whichare n-type impurities even though the semiconductor substrate is ap-type silicon substrate, and the impurities implanted into a portion ofthe diffusion source layer over an N-well are one of B and In, which arep-type impurities even though the semiconductor substrate is an n-typesilicon substrate.
 12. The method of claim 1, wherein one of light B andlight P of p-type and n-type impurities is implanted into the portionsof the diffusion source layer on the upper surfaces of the gate patternsand the semiconductor substrate, and one of heavy In, heavy As, andheavy Sb of p-type and n-type impurities is implanted into the portionsof the diffusion source layer at the sidewalls of the gate patterns. 13.The method of claim 1, wherein forming the shallow source/drain junctionregions by the solid phase diffusion method is performed using one ofRTA, spike annealing, and laser annealing.
 14. The method of claim 13,wherein in the RTA, the semiconductor substrate on which the diffusionsource layer containing the impurities is formed is annealed at atemperature of 950-1150° C. for 1-1000 seconds in an inert gasatmosphere.
 15. The method of claim 13, wherein in the spike annealing,the semiconductor substrate on which the diffusion source layercontaining the impurities is formed is annealed at a temperature of950-1200° C. in an inert gas atmosphere.
 16. The method of claim 1,wherein the shallow source/drain junction regions have a doping depth of50 nm or less on the semiconductor substrate and a doping concentration10¹⁸-10²² cm⁻³.
 17. A method of fabricating a MOS transistor comprising:forming gate patterns on a semiconductor substrate in which a P-well andan N-well are formed; forming a diffusion source layer on the entiresurface of the semiconductor substrate; forming a photoresist pattern onthe diffusion source layer to open the N-well or the P-well; implantingthe same type or different type of impurities first into a portion ofthe diffusion source layer over the N-well and then into a portion ofthe diffusion source layer over the P-well, or first into the portion ofthe diffusion source layer over the P-well and then into the portion ofthe diffusion source layer over the N-well, according to a plurality ofimplantation angles relative to the semiconductor substrate so that theimpurity concentration of portions of the diffusion source layer onupper surfaces of the gate patterns and the semiconductor substrate ishigher than the impurity concentration of portions of the diffusionsource layer at sidewalls of the gate patterns due to a shadow effect;removing the photoresist pattern; and diffusing impurities contained inthe portions of the diffusion source layer over the N-well and theP-well into the semiconductor substrate by a solid phase diffusionmethod to form shallow source/drain junction regions having LDD regionsunderneath the sidewalls of the gate patterns and highly dopedsource/drain regions by a self-alignment method.
 18. The method of claim17, wherein the diffusion source layer is an USG layer or a siliconoxide layer.
 19. The method of claim 17, wherein the diffusion sourcelayer is formed to a thickness of 20-400 nm.
 20. The method of claim 17,wherein the whole of the diffusion source layer or a portion of thediffusion source layer is etched to be thin.
 21. The method of claim 17,wherein the implantation of the impurities into the diffusion sourcelayer is performed using one of a general ion implanter and a plasma ionimplanter including a PIII and an ISI.
 22. The method of claim 17,wherein the impurities are implanted into the diffusion source layer atan angle from the semiconductor substrate to adjust the impurityconcentration of the portions of the diffusion source layer at thesidewalls of the gate patterns to 10¹⁷-10²² cm⁻³ .
 23. The method ofclaim 17, wherein the impurities are implanted vertically into thediffusion source layer to adjust the impurity concentration of theportions of the diffusion source layer on the upper surfaces of the gatepatterns and the semiconductor substrate to 10¹⁸-10²² cm⁻³.
 24. Themethod of claim 17, wherein the impurities implanted into a portion ofthe diffusion source layer over the P-well are one of P, As, and Sb,which are n-type impurities even though the semiconductor substrate is ap-type silicon substrate, and the impurities implanted into a portion ofthe diffusion source layer over the N-well are one of B and In, whichare is p-type impurities even though the semiconductor substrate is ann-type silicon substrate.
 25. The method of claim 17, wherein one oflight B and light P of p-type and n-type impurities is implanted intothe portions of the diffusion source layer on the upper surfaces of thegate patterns and the semiconductor substrate, and one of heavy In,heavy As, and heavy Sb of p-type and n-type impurities is implanted intothe portions of the diffusion source layer at the sidewalls of the gatepatterns.
 26. The method of claim 17, wherein forming the shallowsource/drain junction regions by the solid phase diffusion method isperformed using one of RTA, spike annealing, and laser annealing. 27.The method of claim 17, wherein the shallow source/drain junctionregions have a doping depth of 50 nm or less on the semiconductorsubstrate and a doping concentration 10¹⁸-10²² cm⁻³ .
 28. The method ofclaim 17, wherein impurities are implanted into the portion of thediffusion source layer over the N-well or the P-well, the photoresistpattern is removed, and the impurities contained in the portion of thediffusion source layer are diffused into the semiconductor substrate toform shallow source/drain junction regions.